Leti-CEA


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17 Avenue des Martyrs, 38054 Grenoble

Category: Microtechnics

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CEA-Leti Reports Three-Layer Integration Breakthrough for AI-Embedded CMOS Image Sensors

Innovation - May 31
Innovation

This work demonstrates Feasibility of Combining Hybrid Bonding and High-Density Through-Silicon Vias DENVER - May 31, 2024 - CEA-Leti scientists reported a series of successes in three related projects at ECTC 2024 that are key steps to enabling a new generation of CMOS image sensors (CIS) that can exploit all the image data to perceive a scene, understand the situation and intervene in it - capabilities that require embedding AI in the sensor.

Innovation - May 31

CEA-Leti Reports Three-Layer Integration Breakthrough On the Path to Offering AI-Embedded CMOS Image Sensors

Innovation

Three-Layer Test Vehicle Is a Key Milestone Because It Demonstrates.

First Complete Vascularization of Organoids on Microfluidic Chip

Chemistry - Health

In Vitro System Bypasses -Complex Technical Setups- of Alternative Approaches And Supports Production Scaling e Interdisciplinary Research Institut

EU Consortium Developing Next-Gen Edge-AI Technologies Is Accepting Design Proposals

CEA-Leti, Fraunhofer, imec and VTT Anchoring Multi-Hub Platform to Realize Designs By EU Companies, Researchers and Chip Developers A new European Union consortium created to accelerate the development of next-generation, ed

Architecture - Feb 21

Novel Architecture for Keyword-Spotting (KWS) In Always-On, Voice-Activated Edge-AI Systems

CEA-Leti Develops Novel Architecture for Keyword-Spotting (KWS) In Always-On, Voice-Activated Edge-AI Systems -ISSCC 2024 Presentation Reports Accurate Speech Recognitio a t Power Consumption Below One Microwatt GRENOBLE, Fra

CEA-Leti Papers at Photonics West Report Progress Towards MicroLED Bandwidth and Efficiency Improvement

CEA-Leti will present two papers on its microLED technology advances at Photonics West 2024 about making matrices of LEDs with increased data-rate density, and strategies to reduce their efficiency loss at small sizes.

Embedded artificial intelligence

The European InSecTT project focuses on the security of embedded AI. As a partner in this three-year project, CEA-Leti developed innovative solutions to authenticate intelligent systems and protect them from various cyberattacks.

International Research Team Achieves First-Reported, Complete Vascularization of Organoids on Microfluidic Chip

In Vitro System Bypasses -Complex Technical Setups- of Alternative Approaches And Supports Production Scaling e Interdisciplinary Research Institute of Grenoble (IRIG) , CEA-Leti and fellow European and Canadian institutes a

CEA-Leti Reports Breakthrough 3D Sequential Integration (3DSI) Of CMOS Over CMOS with Advanced Metal Lines

CEA-Leti, Fraunhofer, imec and VTT Anchoring Multi-Hub Platform to Realize Designs By EU Companies, Researchers and Chip Developers.

UC San Diego and CEA-Leti Report First IC for Piezoelectric Resonator DC-DC Conversion Achieving a 310% Loss Reduction

ISSCC 2024 Paper Says 'Ground-Breaking' DC-DC Converter Unifies Power Switches on a Single Chip-. S AN DIEGO and GRENOBLE, France - Feb.