CEA-Leti to Report New Integration & Packaging Gains for Next-Generation LiDAR Steering on Autonomous Vehicles at ECTCSeven Papers Highlight Results with High-Level Integration of Technologies & Components for HPC/Edge-AI Chiplets, Optical Computing, Displays and Imagers - CEA-Leti will present new integration and packaging technologies for next-generation LiDAR optical-network driving devices in autonomous vehicles at the Electronic Components and Technology Conference , May 30-June 2, in Orlando, Fla.
